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  • Kendu Technology Co., Ltd. - logo

  • Kendu Technology Co., Ltd.

  • Interconnects Plugs, Jacks & Sockets Modular jacks
  • 3004 Very Low Profile, With Solder Pad - Kendu Technology Co., Ltd.

  • 3004 Very Low Profile, With Solder Pad


Description

3004   Very Low Profile, With Solder Pad

Materials
 Shield: Brass With Nickel Plated.
 Housing: High Temp. Thermoplastic.
                  Flammability Rating UL 94V-0
 Contacts: 0.35mm Thickness Phosphor Bronze.
 Plating: Gold Plating Over Nickel In Contact Area.
                 Tin Plating Over Nickel In Solder Area.


Supplier Information

Kendu Technology Co., Ltd.

TEL : 886-2-2695-0505 FAX : 886-2-2692-6565
9F, No.236, Jung Hsing Rd., Hsi-chih Dist., New Taipei City, post code 22158, Taiwan
Web-Site : http://www.kendu.com.tw/
E-Mail : melody@kendu.com.tw
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